Wafer Quote Form
Please Submit Form Below

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1. Quantity:

 

2. Wafer Size:
   100mm    125mm    150mm    200mm    300mm   
   Other

 
 
3. Wafer Type:
   a. Substrate
  Silicon    Glass Other
   b. Substrate will be supplied by:
   Thermodynamic Sensors    Customer
   c. Polishing
   Single Side Polished    Double Side Polished
 
 

4. Process Temperature Range:
   deg C to deg C with a maximum temperature of deg C

  
 
5. Process Conditions:
Vacuum    RTP    Plasma
Atmosphere  Other
 
 

6. Thermocouple Type:
   K-type    R-type    Other

 
 

7. Wire Diameter:
   0.254 mm (30guage)    0.127 mm (36guage)

 
 

8. Quantity of Thermocouples on Assembly:

 
 

9. Thermocouple Locations (please note position of Notch/Orientation):
  

 
 

10. Wire Stress Relief:

   Yes    No

 
   
 

11. LEADWIRE A: Length

   mm    Inch

a.Insulation Material: Braided Ceramic Sleeve Braided Silicia Sleeve
Quartz Tube Polymide sleeve Telflon Sleeve
Other
b. BUNDLING: Oversleeve Ties None
 
  12. POLYMIDE TAPE FEEDTHRU: Yes   No

Length: 2" 4" 6" 8" 10" 12" 		 
 
13.LEAD WIRE B: Length: mm Inch
Insulation Material: Teflon sleeve Polymide sleeve
Other
BUNDLING: Oversleeve Ties None
 
 

14. Lead Wire Terminations Types:

Bare leadwire Mini Plug Spade tang Other

 
 
15. Calibration to NIST Traceable Standards
a.   Yes    No

b. If entire assembly is to be calibrated to NIST standards,
   what temperature points are to be used:
 
 

16. Questions or comments:
  

 
     
     
     
 

16. Contact Information

 

   Name:

 

Company:

 

   Email:

 

Title:

 

   Phone :

 

Fax Number:

 

   Address:

   

   City:

 

State:

 

Zip Code:

  Country:

 

 

   
     

To Order Call: 800.523.2002(USA) – 610.692.7990(International)
Fax orders to: 610.430.1325